Abstract:
In this paper we have shown that some aromatic amines like aniline, benzylamine, N-methylaniline, Nethylaniline, N,N-dimethylaniline, N,N-diethylaniline, o-toluidine, m-toluidine and p-toluidine added in the electrolyte
solution influence the copper electrodeposition process by decreasing the diffusion layer thickness. Experimental results
have been obtained by linear sweep voltammetry and chronoamperometry. The qualitative results obtained by linear
voltammetry show a significant effect of aromatic amines on the cathodic copper electrodeposition. The semi-quantitative
results obtained by chronoamperometry have been used to determine the diffusion coefficient of Cu2+ ions using the
Randles – Sevcik equation. The calculated values of the diffusion layer thickness decrease from 40 μm in the blank
electrolyte solution to 13 μm in the presence of 1 mL L-1 m-toluidine.
Keywords:
copper electrodeposition, diffusion coefficient, diffusion layer thickness, chronoamperometry
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